T/R component module is the connection between wireless transceiver system IF and antenna, that is one end connected antenna and the other connected IF processing unit, which form a wireless transceiver system.As a core component, T/R component module can be realized by multi chip SIP package, based on LTCC substrate technology. The technological advantages will continue to promote the development of T/R components to miniaturization and high performance.
T/R Component Module & LTCC Substrate Products
Welcome to our booth at Pacifico Yokohama in Kanagawa prefecture from Nov 15th to 17th 2017
Glead Electronics Attended the 2017 Nuremberg International Exhibition of Embedded Application