We provide series of standardized size of the SAW filter substrate and duplexer package substrate, which meet the requirements of flip chip and SMT process. We also provide series of ceramic package applied to the fields of automotive electronics, base station and aerospace.
Surface Acoustic Wave Packaging Substrates
Welcome to our booth at Pacifico Yokohama in Kanagawa prefecture from Nov 15th to 17th 2017
Glead Electronics Attended the 2017 Nuremberg International Exhibition of Embedded Application