The basic manufacturing process for LTCC is described as following: Firstly, the LTCC powder is used to make slurry and cast into tape to obtain condensed green sheets with precise thickness. The vias for conduction between layers are punched, followed by filling conductive paste into visa using printing method. The substrate can be mounted with IC and active components to create passive & active multi-function modules. By using LTCC technology, microwave circuit can be further minimized and densified. Particularly applied to the field of high frequency communication module.
Low Temperature Co-fired Ceramic
